| Seg. | Product | Min. Investment | Turnover Incentive (%) | CAPEX Incentive |
|---|---|---|---|---|
| Sub-assemblies | ||||
| A |
Display Module Sub-assembly
|
₹250 Cr | 4 / 4 / 3 / 2 / 2 / 1 | N/A |
| A |
Camera Module Sub-assembly
|
₹250 Cr | 5 / 4 / 4 / 3 / 2 / 2 | N/A |
| Bare Components | ||||
| B | Non-SMD Passive Components |
₹50 Cr | 8 / 7 / 7 / 6 / 5 / 4 | N/A |
| B | Electro-mechanicals |
₹50 Cr | 8 / 7 / 7 / 6 / 5 / 4 | N/A |
| B | Multi-layer PCB |
₹50 Cr | 6 / 6 / 5 / 5 / 4 / 4 | N/A |
| B |
Li-ion Cells
Digital applications (excl. storage & mobility)
|
₹500 Cr |
≤6 Layers: 6 / 6 / 5 / 5 / 4 / 4
≤8 Layers: 10 / 8 / 7 / 6 / 5 / 5
|
N/A |
| B |
Enclosures
Mobile, IT hardware & related devices
|
₹500 Cr | 7 / 6 / 5 / 4 / 4 / 3 | N/A |
| Selected Bare Components | ||||
| C | HDI / MSAP / Flexible PCB |
₹1,000 Cr | 8 / 7 / 7 / 6 / 5 / 4 | 25% |
| C | SMD Passive Components |
₹250 Cr | 5 / 5 / 4 / 4 / 3 / 3 | 25% |
| Supply Chain Ecosystem & Capital Equipment | ||||
| D |
Supply Chain of Sub-assemblies & Bare Components
Segments A, B & C
|
₹10 Cr | N/A | 25% |
| D |
Capital Goods for Electronics Manufacturing
Including sub-assemblies & components
|
₹10 Cr | N/A | 25% |








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